Wafer的制造
<DIV><P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=3><SPAN lang=EN-US><FONT face="Times New Roman">Wafer</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的制造涉及到一系列的机械工艺。</SPAN></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'"></SPAN><FONT size=3><SPAN lang=EN-US><FONT face="Times New Roman">Ingot</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">两头的锥形末端会被切掉。剩下的就被磨成圆柱体，它的直径就决定了最后的</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">wafers</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的尺寸。研磨后就没有看得见的晶体方向标志了。晶体的方向是由实验确定的，沿着</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">ingot</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的某个边会磨出一个平面。每个从它上面切下来的</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">wafer</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">就会有一个刻面，或</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">flat</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">，这样就明白无误的指出了晶体的方向。</SPAN></FONT></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN-US><?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" /><o:p><FONT face="Times New Roman" size=3> </FONT></o:p></SPAN></P>
<P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><FONT size=3><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">研磨出</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">flat</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">后，制造商就用带钻石嘴的锯子把</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">ingot</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">切成</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">wafers</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">。这道工艺中，有大于三分之一的宝贵的硅晶体就这样变成了没用的粉尘。由于要经过切割工艺，</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">wafers</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的表面都是刮痕。由于集成电路的微小的尺寸要求特别光滑的表面，因此</SPAN><SPAN lang=EN-US><FONT face="Times New Roman">wafer</FONT></SPAN><SPAN style="FONT-FAMILY: 宋体; mso-ascii-font-family: 'Times New Roman'; mso-hansi-font-family: 'Times New Roman'">的一面必须被抛光。这道工艺开始于机械研磨结束于化学研磨。最终像镜子一样亮的表面是暗灰色的并发出硅特有的接近金属的光泽。</SPAN></FONT></P></DIV>
Re: Wafer的制造
“沿着ingot的某个边会磨出一个平面”，有的是磨两个平面，看具体是100，111。。还有掺杂类型（P型orN型）和浓度；现在最先进10英寸，12英寸的已经不是磨平面的，而是磨小凹操来标志。
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