bo6543210 发表于 2012-8-25 09:02:21

看过大侠以前的帖子,感慨良多,希望大侠以后多多指教

谁会爱地瓜 发表于 2012-8-25 09:03:00

认识深刻,见多识广

surfacer 发表于 2012-8-25 10:42:50

再上牛得一塌糊涂的Cisco Systems:


Location: UNITED STATES.CALIFORNIA.SAN JOSE




Job Title: Server Mechanical Design Lead



Area of Interest: Engineering - Hardware



Job Description: Mechanical Design Technical Leader

Opportunity Snapshot:
In this role you will be part of team designing the next generation of UCS C-series rack servers. We are looking for candidates who strive in a fast paced start-up like environment. You will be part of a dedicated team, open communications, empowerment, innovation, teamwork and customer success are the foundations of the team. Thus, you set your own limits for learning and achievements. We are looking for a self driven individual who can lead cross functional teams and work closely with a wide variety of internal & external engineering partners to enable them to leverage our products for their needs.

Job Requirements:
• Drive requirements and specifications for chassis design of Cisco’s UCS C-series rack servers.
• Strong designer of chassis and mechanical sub-assemblies, with 10+ years experience.
• Understanding of thermal design, acoustics, power efficiency, and finite element analysis.
• Design for high volume tooling and DFM for assembly.
• Provide guidance to other teams on trade offs on costs.
• Work with third-party vendor engineering teams, and drive ODM vendors.

Technical Background
• Candidate must have first hand experience in the design or implementation of multiple chassis for the modern datacenter.
• Expert user and knowledge of ProE
• Familiarity with the latest cooling techniques and heatsink design
• Hands on experience with Intel processor based platforms
Experience leading small technical teams to complete complicated mechanical assemblies for mass-production



==================================
要不要搞机械结构的?要不要设计机箱?

surfacer 发表于 2012-8-25 10:52:37

还是思科的,Mechanical Engineer III


Job Description: Conceptualize, plan and execute the design and development of 1U switch packaging products. Consults with cross-functional units for product requirements, definitions and design. Defines, directs and participates in the design verification and testing of new products.

• Direct electronics industry experience, well skilled in the art and science of electronics packaging at the board, box and rack level.
• Proficiency in developing conceptual and production designs using Siemens’s NX 3-D solids modeling software, version 10. 4000hr plus of recent experience. Other MCAD application experience considered.
• Has experience in the design and development of tooling for high volume sheet metal, plastic and die casting.
• Expertise in designing high volume, cost effective products that meet worldwide customer, regulatory and compliance requirements.
• Thermal management and structural design expertise. Proficiency using Flotherm for CFD thermal simulations would be a plus.
• Responsibilities include initiating informal reviews of ideas and technical objectives within and across business units.
• Successful Candidate is expected to perform with little management direction
• Exceptional written and verbal communication skills
• Grace under pressure and a positive attitude are mandatory.
• History of successful collaboration with project teams required
• Demonstrates ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications.
• Enjoys working in a fast paced and often multi-project environment.

Educational Background Recommended
Typically requires BSME or equivalent training with 7-10+ yrs related exp. Preferred: MSME or equivalent

===========================================
学历,工作经验,行业经验,工艺知识,软件操作,这些要求一样不缺,也一样不多,与国内能有什么两样?



surfacer 发表于 2012-8-25 10:58:29

还是思科的,热设计岗位:


Job Description: Conceptualize, plan and execute the design and development of network switch products with emphasis in thermal management. Direct electronics industry experience, well skilled in the art and science of electronics packaging at the board, box and rack level,

Must be knowledgeable with all modes heat transfer in electronics (convection, conduction and radiation) and should be able to balance the design to use each mode effectively, efficiently and to the best cost advantage.

Good thermal modeling skills are expected and successful candidate should be adept at laboratory methods as well. Proficiency using Flotherm for CFD thermal simulations is required.

Consults with cross-functional units for product requirements, definitions and design. Defines, directs and participates in the design verification and testing of new products.

-Help define thermal design of Cisco’s products that meets or exceeds the requirements
while balancing multiple changing and conflicting requirements.
-Develops multiple platforms concurrently.
--Collaborate on investigations of new thermal technologies and materials.
-Interfaces directly with partner companies in prototype development.
- Takes direction and input from product design architects and tech leads in design and implementation of the best thermal solution for the product.
-Define, guide and complete statistical data reduction of thermal lab experiments to characterize thermal materials, cooling components, and cooling systems.
-Performs extensive Thermal modeling and testing, correlates results, and provides simple and concise summaries to management and non-thermal engineering peers.
-Communication of status/results via presentations to thermal/product design team.
-Actively participate in cross-functional team design reviews and technology investigations.
-Manages work and test done by technicians and lower level engineers.
-Expertise in designing for high volume, cost effective products that meet worldwide customer, regulatory and compliance requirements.
-Initiates informal reviews of ideas and technical objectives within and across business units.
-Proficiency in structural analysis desired
-Some expertise in a 3D solids based MCAD system desired.
-Experienced in thermal and airflow testing
-Excellent communication skills
-Experienced in Networking/Computer product development
-Experienced with blower and fan design
-Experienced with both forced and natural convection, conduction and radiation heat transfer techniques
-Experience with manufacturing, thermal parts/components supply chains and cross-communications between design, ODM and third party vendor teams

Successful Candidate is expected to perform with little management direction. Demonstrates ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications. Enjoys working in a fast paced and often multi-project environment. Exercises considerable latitude in determining technical objectives of assignment. Completed work is reviewed by management through consultation from a relatively long time perspective, for results. Translates BU level goals in to own work assignments. Interfaces cross-functionally and leads team collaboration extending beyond work group. Requires excellent verbal skills and professional presentation. Sponsors and models exemplary team interaction. Encourages and accepts personal feedback. Mentors junior team members. Demonstrate ability to successfully influence win-win cross-functional dynamics. Resolves conflicts by fostering team communications. Provides technical guidance to small teams. Takes ownership for initiatives and drives on-going evaluation and success. Determines own methods on issue resolution. Uses judgment to solve problems where protocol might not exist. Applies high degree of ingenuity using broad parameters for foundation of decisions.


Solve Problems & Make Decisions. Demonstrate Leadership. Establishes Plans. Thinks Globally. Dedication to Customer Success. Innovation and Learning.

Educational Background Recommended
Typically requires BSME or equivalent training with 7-10+ yrs related exp. Preferred: MSME or equivalent.


everfree 发表于 2012-8-25 11:04:54

surfacer 发表于 2012-8-25 10:52 static/image/common/back.gif
还是思科的,Mechanical Engineer III




Conceptualize, plan and execute the design and development of 1U switch packaging products. Consults with cross-functional units for product requirements, definitions and design. Defines, directs and participates in the design verification and testing of new products.

===========这段是职责范围要求,您给翻译一下好吗?

surfacer 发表于 2012-8-25 11:20:25

再上思科招的中国Senior Mechanical Design Engineer要求:


Job Description: Responsibilities:

1.Plan and execute the design and development of system packaging for internetworking products. 2.Defines, participates in the design verification and testing of new products.
3.Leads the resolution of field and product problems.
4.Selects electro-mechanical components such as air movers, heatsinks and complex interconnection systems and supports the evaluation and selection of new suppliers. 5.Provides vendors with improvement recommendations.
6.Responsible for the design and documentation of computer enclosures and related electro-mechanical assemblies using solids modeling techniques.
7.Performs system level structural and thermal analysis and analysis data is in-depth. Involve the determination of form factors, raw materials, and manufacturing processes.
8.Consults with internal cross-functional units for definition and design of product requirements. Be able to take the leadership in the design and development of a sub system in a high complex engineering projects.
9.Involve in developing technical content of the system specification/unit function specification.
Identifies issues and technical interdependencies and suggests possible changes.

Requirements:
1.Fluency in spoken and written English. Expertise in designing to meet worldwide compliance requirements.
2.Technical expertise in 3D solids based MCAD system and desire for maximum productivity. Proficiency in Thermal Analysis tools (Flotherm, Icepak, etc.) and/or structural analysis SW tools (Ansys, Pro Mechanical etc) desirable. 3.Able to perform complex stress, beam and thermal calculations to guide designs. 4.Proficient in geometric tolerance and tolerance analysis.
5.Able to generate test plans, conduct tests and generate test reports for Thermal and MDVT. Understanding of Safety Agency design criteria and EMC design techniques for modules and enclosures.
6.Works independently, initiates reviews of ideas with stake holders. Interfaces cross-functionally and participates in cross-functional consultation with Customer Services, Mfg, Mktg and HW Engineering.
8.Customer resolution requires excellent verbal skills and professional presentation.

Education:
BSME with 5-7 years, or MSME with 5+ years, Global work experience with US companies preferred.


==================
除了多了一项要求:Fluency in spoken and written English,其它还真的没有本质性差别

everfree 发表于 2012-8-25 11:45:06

思科是做系统的,却要有机械设计师,按说这不难理解。但是surfacer社友揪住做系统的不做箱子一句话不放,我想对于不了解工业的外行人来说,这种情况也可以理解。举个例子:波音公司,也是个做系统的,但是他不制造发动机、起落架、液压件、仪表、通讯设备、座椅。。。。。。,但是他必须拥有上述各个专业的工程师,甚至美术设计师,进行各方面设计、研究,否则波音设计不出飞机。思科也是一回事,系统商,不是部件、组件、细分产品的制造商,但是他必须有各个方面的设计师。说到这里,我想surfacer社友应该明白楼主那句话的意思了。

chidiandong 发表于 2012-8-25 12:02:47

楼上说的好,998大侠说的更好。

pfizer2001 发表于 2012-8-25 12:46:37

宝钢是日本最先进的技术吧!应该宝钢是国内最好的钢铁制造企业?为什么宝钢生产不出来好的钢材?
还有,998说的玩,我很认同,如果不喜欢,去干一件事情,是很崩溃的,美国的大学很累的,要比清华北大累多了去了,不仅仅一个月几次的考试,还有项目,还有很多
德国 或者英国确实很重视技术学校,在瑞士有一个公司叫BUCHI ,里面需要吹玻璃的工人,而这个角色好多是祖传,或者是技术学校毕业就在这个公司做的 公司一般有50-100甚至200年的历史,德国也有好多 公司在一个不起眼的小镇子,镇子里的大部分给这个公司做配套
还有大公司肖特,制作玻璃的,高端的玻璃用于望远镜,光学的,低端的制造很多玻璃仪器,但是质量都很牛
日本的小松,哈哈,那天看兵器杂志,说二战的时候日本生产的坦克,小松专门给生产装甲,术业有专攻,日本人尊敬技师,我们似乎尊敬村长 乡长 县长
有的人说制度不行,我觉得还做台湾的制度,我们能马上好起来么?
不是一天两天了,病入膏肓,民族性格,等等,
苏联的官二代以当一个数学家,钢琴家为骄傲,我们呢/?
子承父业,哈哈100年来,我们回到了起点!
页: 1 2 3 [4] 5 6
查看完整版本: 你与米国